MECHANIC Solder Paste XGZ40

Description:

The “MECHANIC Solder Paste XGZ40” is a solder paste specifically designed for mobile phone PCB (Printed Circuit Board) repair, SMD (Surface Mount Device) soldering, and BGA (Ball Grid Array) rework. Solder paste is a mixture of solder alloy particles and flux, used in electronics soldering applications, particularly for surface mount technology (SMT) soldering.

Features:

1. Solder Paste XGZ40: The product is the MECHANIC brand’s XGZ40 solder paste, indicating its high-quality and reliability.
2. Syringe Packaging: The solder paste is packaged in a syringe for easy application and precise solder deposition.
3. Flux Core: The solder paste contains flux, which aids in removing oxidation and facilitating the soldering process by promoting solder flow and wetting.
4. Melting Point 183°C: The solder paste has a melting point of 183°C, making it suitable for soldering applications requiring this specific temperature.
5. Mobile Phone PCB Repair: The solder paste is specifically designed for repairing mobile phone PCBs, making it ideal for microelectronics and small-scale soldering.
6. SMD and BGA Rework: The solder paste is suitable for surface mount device (SMD) soldering and ball grid array (BGA) rework, where precise and controlled soldering is required.
7. Versatile Application: The solder paste can be used for various soldering projects and electronic repair tasks that require a melting point of 183°C.