Key Features:
- Optimal Melting Point: With a melting point of 183°C, it ensures easy and efficient soldering without damaging sensitive components.
- High Reliability: The unique chemical formula and high-quality additives provide excellent wetting, strong adhesion, and high reliability, suitable for SMT/BGA soldering processes.
- Good Viscosity: The moderate viscosity ensures minimal patch collapse and prevents components from shifting during the soldering process.
- Extended Storage Life: When stored in a refrigerated environment, it can last up to 12 months, maintaining its properties for long-term use.
- Versatile Application: Suitable for various welding environments and compatible with multiple soldering processes.
- Eco-Friendly: The flux residue is colorless and transparent, ensuring no interference with circuit detection and offering excellent cleaning performance.
Specifications:
- Content: Sn63/Pb37 alloy composition
- Microns: 20-38um
- Weight: 30g
- Compatibility: Ideal for mobile phone repairs, computer digital services, and high-precision circuit board soldering.
Usage Instructions:
Ensure to apply the paste to clean and prepared surfaces. Avoid prolonged contact with the skin, and store it in a cool, well-closed container to maintain its properties.
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